Electronic device with signal line routing to minimize vibrations

ABSTRACT

An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.

This application is a continuation of patent application Ser. No.14/831,109, filed Aug. 20, 2015, which claims the benefit of provisionalpatent application No. 62/044,527 filed Sep. 2, 2014, which are herebyincorporated by reference herein in their entireties.

BACKGROUND

This relates generally to electronic devices, and, more particularly, toelectronic devices that include magnets and other sources of magneticfield.

Electronic devices sometimes include sources of magnetic field such asmagnets. For example, a display cover glass layer or other devicestructure may be mounted to a device housing using magnets andferromagnetic materials that are attracted to magnets. Magnets andferromagnetic materials may also be used as parts of latches in devicecovers, may be used to hold a device to a docking station, may be usedas parts of speakers and other electrical components, and may beincorporated into other portions of a device. In some devices, magneticfields may be produced by flowing currents and can interact with magnetsand ferromagnetic material.

An electronic device supplies control signals to electrical componentsduring operation. For example, signals may be provided tolight-producing components, sensors, displays, integrated circuits, andother components.

If care is not taken, vibrations can be inadvertently produced within anelectronic device. These vibrations, which may create undesirable noise,may arise due to the interaction between the magnetic field produced bya magnet, currents flowing in a device, and/or ferromagnetic materialand the magnetic fields produced by time-varying currents flowing withina device.

It would therefore be desirable to be able to provide ways in which toreduce undesired noise in electronic devices such as noise that isproduced from vibrations due to the interaction of magnetic fields fromsignal currents and magnetic fields from magnets, ferromagneticmaterials, and current sources within electronic devices.

SUMMARY

An electronic device may have a source of magnetic field such as apermanent magnet, a ferromagnetic material, or currents flowing withinthe device. Flexible printed circuits and other substrates may coupleelectrical components in the device together. A flexible printed circuitmay have a flexible tail that surrounds a central portion. The centralportion may overlap the magnet (or other source of magnetic field) sothat the magnetic field from the magnet passes through the centralportion. Electrical components may be mounted to the central portion.The tail may serve as a service loop that allows a detachable portion ofa housing for the device and electrical components that are mounted tothe central portion in alignment with windows in the detachable portionof the housing to be detached for servicing.

The flexible printed circuit may have signal lines that extend from thetail to the central portion. Signals flowing in the signal lines mayproduce magnetic fields. To prevent undesired vibrations and noise dueto interactions between the magnetic fields induced by the signals andthe static magnetic field, the signal lines may be vertically stacked ormay be routed in a spiral pattern that does not overlap the magnet.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram of an illustrative electronic device in accordancewith an embodiment.

FIG. 2 is a diagram of an illustrative magnet and structures in anelectronic device that may produce magnetic fields that interact withmagnetic fields from the magnet in accordance with an embodiment.

FIG. 3 is a cross-sectional side view of an illustrative flexibleprinted circuit having signal lines arranged to minimize vibrations inaccordance with an embodiment.

FIG. 4 is a top view of an illustrative flexible printed circuit havingsignal lines routed around a magnet to minimize vibrations in accordancewith an embodiment.

FIG. 5 is a cross-sectional side view of illustrative electronic devicewith a magnet and a printed circuit that overlaps that magnet inaccordance with an embodiment.

FIG. 6 is a cross-sectional side view of the illustrative electronicdevice of FIG. 5 in a configuration in which a portion of a devicehousing is detached from the rest of the device housing in accordancewith an embodiment.

FIG. 7 is a top view of an illustrative flexible printed circuit thathas a service loop to accommodate detachment of a detachable portion ofa device housing and that has signal lines routed to minimize noise inaccordance with an embodiment.

FIG. 8 is a cross-sectional side view of flexible printed circuitstructures of the type that may be associated with the flexible printedcircuit of FIG. 7 in accordance with an embodiment.

DETAILED DESCRIPTION

An illustrative electronic device is shown in FIG. 1. As shown in FIG.1, electronic device 10 may have control circuitry 16. Control circuitry16 may include storage and processing circuitry for supporting theoperation of device 10. The storage and processing circuitry may includestorage such as hard disk drive storage, nonvolatile memory (e.g., flashmemory or other electrically-programmable-read-only memory configured toform a solid state drive), volatile memory (e.g., static or dynamicrandom-access-memory), etc. Processing circuitry in control circuitry 16may be used to control the operation of device 10. The processingcircuitry may be based on one or more microprocessors, microcontrollers,digital signal processors, baseband processors, power management units,audio chips, application specific integrated circuits, etc.

Input-output circuitry in device 10 such as input-output devices 18 maybe used to allow data to be supplied to device 10 and to allow data tobe provided from device 10 to external devices. Input-output devices 18may include buttons, joysticks, scrolling wheels, touch pads, key pads,keyboards, microphones, speakers, tone generators, vibrators, cameras,sensors, light-emitting diodes and other status indicators, data ports,light-emitting diodes that form part of a sensor or communicationsdevice, light detectors that form part of a sensor or communicationsdevice, etc. A user can control the operation of device 10 by supplyingcommands through input-output devices 18 and may receive statusinformation and other output from device 10 using the output resourcesof input-output devices 18.

Input-output devices 18 may include one or more displays. Device 10 may,for example, include a touch screen display that includes a touch sensorfor gathering touch input from a user or a display that is insensitiveto touch. A touch sensor for a display in device 10 may be based on anarray of capacitive touch sensor electrodes, acoustic touch sensorstructures, resistive touch components, force-based touch sensorstructures, a light-based touch sensor, or other suitable touch sensorarrangements.

Control circuitry 16 may be used to run software on device 10 such asoperating system code and applications. During operation of device 10,the software running on control circuitry 16 may display images for auser on one or more displays. Device 10 may use communications circuitsto send and receive wireless and wired data. For example, device 10 mayuse light-emitting components to transmit data and may uselight-receiving components to receive transmitted light signals. Device10 may also use light-emitting components, light-receiving components,audio components, capacitive sensors, microelectromechanical systemsdevices, and other components as sensors and output devices.

Device 10 may include components that produce magnetic fields. Forexample, device 10 may include solenoids and other electromagneticcomponents that produce magnetic fields when driven with current. Device10 may also include one or more magnets. Permanent magnets may producestatic magnetic fields. Particularly in device configurations in whichdevices such as device 10 contain magnets that produce static magneticfields, there is a potential for unwanted vibrations to develop withinthe devices during operation.

Consider, as an example, the components of device 10 of FIG. 2. In theexample of FIG. 2, device 10 includes magnet 34. Magnet 34 may be apermanent magnet that produces static magnetic field 56. Device 10 mayalso include one or more substrates such as substrate 20 that includesignal lines 50. Substrate 20 may overlap a source of magnetic fieldsuch as magnet 34, so that magnetic field 56 passes through substrate20. In some configurations, magnetic field 56 may be produced bycurrents flowing in device 10, by a ferromagnetic material, and/or othersources of magnetic field. Configurations in which magnetic field isproduced by magnet 34 are sometimes described herein as an example. Thisis, however, merely illustrative. Magnetic field 56 may, in general, beproduced by any source.

Substrate 20 may be a plastic carrier, a layer of glass, ceramic, orother dielectric, may be a printed circuit, or may be other dielectricstructure that serves as a support for signal lines 50. Signal lines 50may be metal traces (e.g., metal traces that are deposited and patternedusing photolithography) or other conductive signal lines. Printedcircuit board substrates that may be used for forming substrate 20include rigid printed circuit board substrates (e.g., printed circuitsformed form fiberglass-filled epoxy or other rigid printed circuit boardmaterial) and flexible printed circuit substrates (e.g. printed circuitsformed from flexible sheets of polyimide or other flexible layers ofpolymer).

Signal lines 50 may carry signals between circuits on different portionsof printed circuit 20. For example, signal lines 50 may carry digitalsignals, analog signals, power supply signals, etc. In the example ofFIG. 2, signal lines 50 form a signal path that conveys signals betweencomponent 52 and component 54. Components 52 and 54 may be integratedcircuits, discrete components such as a inductors, capacitors, andresistors, may be switches, sensors, light-emitting components such aslight-emitting diodes, light sensors, vibrators, speakers, microphones,displays, touch pads, keys, and other input-output devices 18, controlcircuitry 16 and/or other components in device 10. As an example,component 52 may be an integrated circuit that produces control signalsand/or that processes sensor signals. Paths such as path 50 may be usedto convey control signals between component 52 and component 54.Components 54 may be a light-emitting diode(s) that is controlled by thecontrol signals in path 50, light sensor(s) that supply data tocomponent 52 over path 50, etc.

Device 10 may include a source of magnetic field such as component 34.Component 34 may be a permanent magnet or other component that producesmagnetic field 56 (e.g., a static magnetic field produced by a permanentmagnet). Printed circuit 20 lies in the X-Y plane of FIG. 2. Magneticfield 56 in the example of FIG. 2 is oriented vertically and crossesprinted circuit 20 and signal path 50 at a right angle. Magnet 34 may beused to hold device 10 to a cradle, may be used as a clasp that holds acover or case lid in a closed position, may be used as a detectableidentifier (e.g., to produce magnetic fields that help identify device10 to mating equipment), or may serve other functions within device 10.

When signals are carried over path 50, magnetic fields may be producedin the vicinity of magnet 34. These induced magnetic fields may interactwith static magnetic field 56. In configurations in which path 50carries time-varying signals, the magnetic fields that are induced bythe signals will also be time varying. When the induced magnetic fieldsinteract with static magnetic field 56, forces may be impressed uponprinted circuit 20 and magnet 34. For example, forces may be producedthat alternately cause magnet 34 and printed circuit 20 to be attractedtowards each other and repelled apart from each other. These forces cancause printed circuit 20, magnet 34, and other structures in device 10to vibrate and produce undesired noise.

Device 10 preferably includes signal path configurations for paths suchas path 50 that help to reduce vibrations and thereby minimize oreliminated undesired noise. FIG. 3 is a cross-sectional side view of anillustrative portion of a printed circuit in which signal path lineshave been configured to help minimize interactions with magnetic field56. Printed circuit 92 of FIG. 3 may be a rigid printed circuit board ora flexible printed circuit. As shown in FIG. 3, printed circuit 92 mayhave substrate 90. Substrate 90 may be a flexible substrate formed froma flexible sheet of polyimide or other flexible polymer layer (as anexample). Metal lines 50A and 50B may form signal path 50. Metal lines50A and 50B may be formed in two respective metal layers in printedcircuit 92 (i.e., printed circuit 92 may be a multilayer printed circuitboard in which line 50B is stacked above line 50A).

In the example of FIG. 3, magnetic field 56 is oriented vertically(parallel to vertical dimension Z), whereas printed circuit 92 lies inthe X-Y plane (i.e., surface normal 94 of printed circuit 92 is parallelto magnetic field 56). Lines 50B and 50A run into and out of the page inthe orientation of FIG. 3 (i.e., lines 50A and 50B run parallel to eachother along the Y dimension). Line 50B overlaps line 50A (i.e., lines50A and 50B have the same footprint when viewed in direction −Z). When acurrent is being applied to a component such as component 54 (e.g., alight-emitting diode or other component), current will flow out of thepage in line 50B and will flow into the page in line 50A. In thisconfiguration, a current loop is established in the Y-Z plane thatproduces lateral magnetic field 60. The magnitude of induced magneticfield 60 may vary as a function of time in scenarios in which the signalin path 50 is time varying, giving rise to a risk of unwanted vibrationsdue to the interaction between magnetic field 60 and magnetic field 56.Nevertheless, because of the vertical alignment of line 50B over 50A,magnetic field 60 is oriented in the lateral X direction. The lateralorientation of magnetic field 60 relative to the vertical orientation ofmagnetic field 56 (i.e., the perpendicular orientation of field 60relative to field 56) minimizes interaction between magnetic field 60and magnetic field 56 and thereby helps to reducemagnetic-field-interaction-induced noise in device 10.

In addition to or instead of vertically stacking signal lines tominimize magnetic field interactions, magnetic field interactionsbetween field 60 and field 56 can be minimized by routing path 50 withinthe X-Y plane of printed circuit 92 so that overlap between path 50 andmagnetic field 56 is minimized or avoided. This type of approach isillustrated in FIG. 4. As shown in FIG. 4, printed circuit 92 has ametal traces that form signal path 50 on substrate 90. The metal tracesmay form signal lines 50A and 50B. During operation of device 10,signals may be carried between components 52 and 54 over path 50.Because signal lines 50A and 50B and the current loop these lines createare contained within the X-Y plane of substrate 90 (in the example ofFIG. 4), induced magnetic fields 60 will be oriented vertically alongdimension Z (into and out of the page in the orientation of FIG. 4).Magnetic field 56 from component 34 is also oriented vertically alongdimension Z, which gives rise for a potential for magnetic fieldinteractions. Nevertheless, magnetic field interactions and unwantedvibrations are minimized because path 50 is routed around component 34and magnetic field 56 (i.e., path 50 does not overlap component 34 ormagnetic field 56).

In some device configurations, signal lines may be aligned in avertically overlapping (vertically stacked) configuration of the typeshown in FIG. 3 so that induced magnetic field 60 is orientedperpendicular to magnetic field 56 from component 34. In otherconfigurations, signal lines may be laterally routed around component 34so that the signal lines do not overlap magnet 34. Configurations withboth multilayer vertically aligned signal lines and non-overlappingsignal line patterns may also be used.

FIG. 5 is a diagram of an illustrative electronic device of the typethat may include a source of magnetic field 56 such as component 34.Component 34 may be, for example, a permanent magnet that produces amagnetic field such as magnetic field 56 that is oriented vertically(i.e., parallel to vertical dimension Z). Permanent magnet 34 may beused to help hold device 10 to a docking station, may be used as part ofa clasp, may be used to help hold together structures in device 10, etc.

Device 10 may include display 14. Display 14 may overlap magnet 34.Display 14 may have a display module such as display module 30. Displaymodule 30 may be an organic light-emitting diode display, a liquidcrystal display module, etc. Display module 30 may be mounted underdisplay cover layer 32. Display cover layer 32 may include one or moretransparent layers such as structures formed from glass, plastic,sapphire, ceramic, crystalline material, other materials, orcombinations of these material.

Display 14 may be mounted in housing 12. Housing 12 may be formed fromplastic, glass, metal, carbon-fiber material or other fiber composites,or other suitable materials.

The interior of device 10 may include components 24. Components 24 mayinclude batteries, integrated circuits, sensors, buttons, and otherinput-output devices 18 and control circuitry 16. As shown in FIG. 5,components 24 may include devices 28 that are mounted on one or moresubstrates 26 (e.g., printed circuits, etc.). For example, components 24may include one or more electrical components 28 that are soldered toprinted circuit 26.

In the configuration of device 10 that is shown in FIG. 5, housing 12has a rear wall such as rear housing wall 72. Housing wall 72 may beformed from plastic, glass, metal, carbon-fiber material or other fibercomposites, or other suitable materials. The material(s) used in forminghousing wall 72 may be the same as the material used in forming housingsidewalls such as housing walls 12 of FIG. 5 and/or may be differentfrom the material used in forming housing walls 12.

Rear housing wall 72 may include one or more windows such as windows 70.Windows 70 may be formed from a different type of material than theremainder of the material used in forming rear housing wall 72. Forexample, housing wall 72 may be formed from a material that is opaque,whereas windows 70 may be optical windows formed from opticallytransparent materials (e.g., materials that allow visible light,infrared light, or other light to pass into and out of the interior ofthe housing of device 10). As shown in FIG. 5, there may be one or morecomponents in the interior of device 10 that are in alignment withopenings 70. For example, device 10 may include components such ascomponents 36 and 38 that are attached to rear housing wall 72 and thatare aligned with respective optically transparent windows 70 in rearhousing wall 72. There may be any suitable number of windows 70 indevice 10 (e.g., one or more, two or more, three or more, four or more,less than five, more than 10, etc.).

Components 36 may be interconnected using signal paths such as paths 50of FIGS. 2, 3, and 4 in a substrate such as flexible printed circuit 20.A central portion of flexible printed circuit 20 may be attached to rearhousing wall 72. Flexible printed circuit 20 may have a tail portionsuch as tail 22 that couples flexible printed circuit 20 to components24. Tail 22 of flexible printed circuit 20 may be configured to form aflexible service loop for printed circuit 20. The service loop may beused to facilitate assembly and disassembly of device 10. As shown inFIG. 6, for example, tail 22 may be sufficiently long and flexible toflex so that a detachable portion of rear housing wall 72 can be removedfrom device housing 12 in direction 40 to facilitate rework or repair ofdevice 10.

To minimize magnetic field interactions that could produce undesirablevibrations and noise in device 10, the signal paths in printed circuit20 may be routed using vertically stacked signal line configurations ofthe type shown in FIG. 2 and/or non-overlapping paths of the type shownin FIG. 4.

An illustrative configuration for printed circuit 20 of FIGS. 5 and 6 isshown in FIG. 7. In the example of FIG. 7, flexible printed circuit 20has a circular central portion on which two components 36 and twocomponents 38 have been mounted in a rectangular two-by-two array (i.e.,two rows of components and two columns of components). Components 36 maybe diagonally opposed to each other in the array and components 38 maybe diagonally opposed to each other in the array or other patterns maybe used for mounting components 36 and 38 to printed circuit 20.Flexible printed circuit tail 22 has a curved shape (e.g., a shape withcurved edges) such as a spiral shape that runs around all or nearly allof the circular periphery of the circular central portion of flexibleprinted circuit 20 to which components 36 and 38 are mounted.

The outline of printed circuit 20 may be circular so that printedcircuit 20 may be accommodated in a housing such as housing 12 that hasa circular outline. In the FIG. 7 example, housing 12 has a circularfootprint (when viewed in direction −Z) and printed circuit 20 has acorresponding circular footprint. Configurations for device 10 andprinted circuit 20 with other shapes (e.g., rectangles, ovals, etc.) mayalso be used. For example, housing 12 may have a rectangular footprintand some or all of wall 72 (e.g., the detachable portion of wall 72) mayhave a circular shape. Shapes with combinations of straight and curvededges may also be used for housing 12. The configuration of FIG. 7 ismerely illustrative.

Magnet 34 may be located in the center of housing 12, as shown in FIG.7. Magnetic field 56 (e.g., a static magnetic field from magnet 34) mayextend vertically through the center of printed circuit 20 in thevicinity of components 36 and 38 (i.e., along vertical dimension Z).Connector 200 may be used to couple signal paths 50-1, 50-2, 50-3, and50-4 to components 24. Connector 200 may be, for example, azero-insertion-force connector or other connector that couples traces onprinted circuit 20 to printed circuit 26 on which components 28 havebeen mounted.

Signal path 50-1 may be coupled between the lower right component 36 andconnector 200. Signal path 50-2 may be coupled between the lower leftcomponent 38 and connector 200. Signal path 50-3 may be coupled betweenthe upper left component 36 and connector 200. Signal path 50-4 may becoupled between the upper right component 38 and connector 200.Components 36 and 38 may be any suitable components (see, e.g.,input-output devices 18, control circuitry 16, etc.). With oneillustrative configuration, components 36 are light-emitting diodes thatemit light through a first pair of respective windows 70 in rear wall 72and components 38 are light sensors that detect light that is receivedthrough a second pair of respective windows 70. Components 36 and/or 38may be used as light-based communications devices, as environmentalsensors, as proximity sensors, as sensors that detect bodycharacteristics associated with a user of device 10, or other suitabledevices.

To minimize vibrations that might result from interactions betweeninduced magnetic fields from the signals running through the signalpaths on printed circuit 20 and magnetic field 56, signal paths 50-1,50-2, 50-3, and 50-4 may be routed around component 34 in a spiralpattern (e.g., a spiral path or other curved path), so that the signalpaths do not overlap magnetic field 56. Vertically stacked signal lineconfigurations of the type described in connection with FIG. 2 may alsobe used to minimize magnetic-field-induced vibrations.

Printed circuit 20 may be a single layer printed circuit in which signaltraces are formed on only a single side of a printed circuit substrateor may be a multilayer printed circuit having two or more layers ofsignal lines, three or more layers of signal lines, or four or morelayers of signal lines. Signal lines on different layers of printedcircuit 20 may be coupled using vias (e.g., metal vias that coupleadjacent metal layers by passing through an intervening dielectricsubstrate layer).

With one illustrative configuration, the service loop portion of printedcircuit 20 (i.e., spiral tail 22) may be a two layer flexible printedcircuit and circular central portion 21 of printed circuit 20 thatoverlaps magnet 34 may be a three layer flexible printed circuit. Theuse of three layers for the central portion of printed circuit 20 mayallow printed circuit 20 to be provided with a grounded shielding layerthat can help electromagnetically shield signal lines and componentsthat are sensitive to electromagnetic noise. Other types of printedcircuit may be used if desired. The use of a printed circuit thatcontains a tail portion with two metal layers and a central portion withthree metal layers is merely illustrative.

FIG. 8 is a cross-sectional side view of structures of the type that maybe included in a printed circuit having a two-layer tail and athree-layer central region. As shown in FIG. 8, printed circuit 20 mayhave a three layer central portion such as central portion 21 and mayhave a two-layer tail such as tail 22 that forms a service loop, asdescribed in connection with FIGS. 5 and 6. Dielectric 300 (e.g., aflexible layer of polyimide or other flexible sheet of polymer material)may serve as a substrate for printed circuit 20. Patterned metal traces(e.g., photolithographically patterned blanket layers of metal andvertical metal vias that couple signal lines in respective layers ofprinted circuit 20) may be used in forming signal paths 50-1, 50-2,50-3, and 50-4.

In tail 22, signal path 50-4 may be formed from sensor lines P1 and P2on the lower surface of substrate 300. Signal path 50-2 may be formedfrom sensor lines P3 and P4. These lines may be routed to portion 21 andmay be coupled to sensors 38. Ground layer GND may form electromagneticshielding for the sensor paths and sensors 38 in region 302.

Path 50-1 may be formed from cathode line C1 and anode A in tail 22.Path 50-2 may be formed from cathode line C2 and anode A in tail 22.Anode A may be formed from separate lines or may be shared between paths50-1 and 50-2.

In region 21, anode line A may be coupled to light-emitting diodes 36using vias 304 and a third layer of metal traces (layer 306). Cathode C1may be routed to the lowermost metal layer in region 21 using via 308.Cathode C2 may remain on the lowermost layer in both tail region 22 andin central region 21.

The cross-sectional side view of FIG. 8 illustrates how a two-layerflexible printed circuit design allows tail 22 to be formed fromrelatively thin and flexible structures, whereas a three-layer flexibleprinted circuit design allows shielding layer GND to overlap and shieldsensors 38. Vias can be used to form paths between signal lines ondifferent layers of printed circuit 20. If desired, printed circuit 20may be formed entirely as a three layer substrate, may include portionswith four or more layers, may have only two layer portions, may beformed as a single layer printed circuit, or may have other combinationsof flexible printed circuit layers. The arrangement of FIG. 8 isdescribed as an example.

The foregoing is merely illustrative and various modifications can bemade by those skilled in the art without departing from the scope andspirit of the described embodiments. The foregoing embodiments may beimplemented individually or in any combination.

What is claimed is:
 1. An electronic device, comprising: a housing; adisplay mounted in the housing; a permanent magnet mounted under thedisplay that produces a static magnetic field; a light-emitting diode; aprinted circuit on which the light-emitting diode is mounted, whereinthe static magnetic field at least partially passes through the printedcircuit and the light-emitting diode is mounted to the printed circuitin the vicinity of the permanent magnet; and signal lines on the printedcircuit that are coupled to the light-emitting diode, wherein the signallines produce a second magnetic field and are configured to reducevibrations in the printed circuit due to interactions between the staticmagnetic field and the second magnetic field.
 2. The electronic devicedefined in claim 1 wherein the signal lines are vertically stacked tominimize interactions between the static magnetic field and the secondmagnetic field.
 3. The electronic device defined in claim 1 wherein thesignal lines are routed around the permanent magnet so that the signallines do not overlap the permanent magnet to minimize interactionsbetween the static magnetic field and the second magnetic field.
 4. Theelectronic device defined in claim 1 wherein the printed circuitcomprises a flexible printed circuit that has a curved edge.
 5. Theelectronic device defined in claim 1 further comprising a light sensor.6. The electronic defined in claim 5 wherein the light-emitting diodeand the light sensor detect a body characteristic associated with a userof the electronic device.
 7. The electronic device defined in claim 1wherein the signal lines include first and second metal traces that arecoupled to the light-emitting diode and that do not overlap thepermanent magnet.
 8. The electronic device defined in claim 7 whereinthe first and second metal traces spiral around the permanent magnet. 9.The electronic device defined in claim 1 wherein the permanent magnet isconfigured to hold the electronic device to a docking station.
 10. Anelectronic device, comprising: a housing; a display mounted in thehousing; a source of a magnetic field mounted under the display; alight-emitting diode; a light sensor, wherein the light-emitting diodeand the light sensor detect body characteristics associated with a userof the electronic device; a printed circuit on which the light-emittingdiode is mounted, wherein the magnetic field at least partially passesthrough the printed circuit and the light-emitting diode is mounted tothe printed circuit in the vicinity of the source of the magnetic field;and at least one signal line on the printed circuit that is coupled tothe light-emitting diode, wherein the at least one signal line producesa second magnetic field and is configured to reduce vibrations in theprinted circuit due to interactions between the magnetic field and thesecond magnetic field.
 11. The electronic device defined in claim 10wherein the at least one signal line comprises first and second signallines that are vertically stacked to minimize interactions between themagnetic field and the second magnetic field.
 12. The electronic devicedefined in claim 10 wherein the at least one signal line is routedaround the source of the magnetic field so that the at least one signalline does not overlap the source of the magnetic field to minimizeinteractions between the magnetic field and the second magnetic field.13. The electronic device defined in claim 10 wherein the at least onesignal line includes first and second metal traces that are coupled tothe light-emitting diode and that do not overlap the source of themagnetic field.
 14. The electronic device defined in claim 10 whereinthe source of the magnetic field is a permanent magnet.
 15. Anelectronic device, comprising: a housing; a display mounted in thehousing; a permanent magnet mounted under the display that produces astatic magnetic field; a light-emitting diode; and signal lines that arecoupled to the light-emitting diode, wherein the signal lines produce asecond magnetic field and are configured to reducemagnetic-field-induced vibrations due to interactions between the staticmagnetic field and the second magnetic field.
 16. The electronic devicedefined in claim 15 further comprising: a light sensor, wherein thelight-emitting diode and the light sensor are configured to detect abody characteristic associated with a user of the electronic device. 17.The electronic device defined in claim 15 wherein the signal lines arevertically stacked to minimize interactions between the static magneticfield and the second magnetic field.
 18. The electronic device definedin claim 15 wherein the signal lines are routed around the permanentmagnet so that the signal lines do not overlap the permanent magnet tominimize interactions between the magnetic field and the second magneticfield.
 19. The electronic device defined in claim 15 wherein the signallines include first and second metal traces that are coupled to thelight-emitting diode and that do not overlap the permanent magnet. 20.The electronic device defined in claim 15 wherein the permanent magnetis configured to hold the electronic device to a docking station.